The primary driver for a manufacturing facility build in the semiconductor industry is “time to market.” Because of the length of the business cycle from (1) plan to (2) build to (3) operations, challenges often arise.

To address challenges, companies need to grow their capabilities around the design and construction execution model. Download our whitepaper to understand:

• How to address constraints throughout the cycle.
• How to achieve contract alignment with incentives.
• The various types of commercial and execution arrangements.
• Ultimately, how to support time to market.