Many high-tech manufacturers are moving toward mini cleanroom environments. For example, a semiconductor factory as a whole may only need to be an ISO 10 or 100 classifications, the tool area – where the wafer is exposed – typically has to be ISO 1 classification, the highest and most stringent standard.
Historically, FABs have designed, built and maintained at the highest classification standard. However, this leads to excessive ongoing maintenance costs and workflow concerns for the workforce that operates within that factory on a daily basis.
Thus, the mini cleanroom environment trend has emerged.
The AM Cleanroom Build and Performance group recently completed an ISO 1 classification mini cleanroom environment design build project for a large semiconductor in the Southwest United States.
“Our customer wanted to decrease their ongoing maintenance costs while adhering to the class 1 standards required in their tool area. And since this particular facility is producing above their standard capacity, they needed a team who could reliably complete the project very quickly,” says Emil Bordelon, AM Cleanroom Build and Performance Division.
“Our team designed and executed a solution that allowed them to perform particle scans, leak scans, maintain the temperature and humidity levels for what they are manufacturing, and were able to certify the entire mini environment and all tools because we have the NEBB Certified Professionals as part of our team. We understood their sense of urgency, and were able to meet their needs and minimize lost production time, which translates directly to lost revenue for our customer,” finishes Bordelon.